US Patent Issued to QUALCOMM on Nov. 4 for "Integrated circuit (IC) package employing a re-distribution layer (RDL) substrate(s) with photosensitive dielectric layer(s) for increased package rigidity, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,127, issued on Nov. 4, was assigned to QUALCOMM Inc. (San Diego).

"Integrated circuit (IC) package employing a re-distribution layer (RDL) substrate(s) with photosensitive dielectric layer(s) for increased package rigidity, and related fabrication methods" was invented by Yangyang Sun (San Diego), Manuel Aldrete (Encinitas, Calif.) and Wei Wang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit (IC) packages employing a re-distribution layer (RDL) substrate(s) with photosensitive non-polymer dielectric material layers for increased package rigidity, and related fabrication methods. To reduce or minimize warpage of an IC pack...