US Patent Issued to QUALCOMM on Nov. 4 for "Apparatus and methods for memory data integrity within die architectures" (Indian Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,819, issued on Nov. 4, was assigned to QUALCOMM Inc. (San Diego).

"Apparatus and methods for memory data integrity within die architectures" was invented by Subham Panda (Balasore, India), Nileshkumar Chandrakantbhai Motawala (Surat, India), Radhakrishna Mugada (Hyderabad, India), Sri Ananda Sai Jannabhatla (Hyderabad, India), Muzaffaruddin Mohammed (Hyderabad, India), Jyothi Ramidi (Hyderabad, India) and Venkatesh Petnikota (Kurnool, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatuses directed to improving performance and data integrity within die architectures. In some examples, a die package includes a memory device, and a...