US Patent Issued to QUALCOMM on Nov. 18 for "Wafer level packaging process for thin film inductors" (California, Washington Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,228, issued on Nov. 18, was assigned to QUALCOMM Inc. (San Diego).

"Wafer level packaging process for thin film inductors" was invented by Anshih Tseng (Fremont, Calif.) and Peng Zou (Camas, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An aspect relates to a method of forming an integrated circuit (IC) package, including: forming a thin-film inductor (TFI) over a first dummy carrier wafer; attaching an integrated circuit (IC) die to and over the TFI; attaching a second dummy carrier wafer to and over the IC die; removing the first dummy carrier wafer from the TFI; attaching at least one solder bump to and under the TFI; and removing the seco...