US Patent Issued to QUALCOMM on Nov. 11 for "Package comprising wire bonds coupled to integrated devices" (California, North Carolina Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,811, issued on Nov. 11, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising wire bonds coupled to integrated devices" was invented by Yangyang Sun (San Diego), Rong Zhou (Cary, N.C.), Li-Sheng Weng (San Diego) and Lily Zhao (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package that includes a substrate comprising a cavity, a first integrated device coupled to the substrate through a first plurality of pillar interconnects and a first plurality of solder interconnects, a second integrated device coupled to the substrate through a second plurality of pillar interconnects and a second plurality of solder interconnects, and a pl...