US Patent Issued to QUALCOMM on May 6 for "Capability signaling for uplink demodulation reference signal bundling" (California Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,991, issued on May 6, was assigned to QUALCOMM Inc. (San Diego).

"Capability signaling for uplink demodulation reference signal bundling" was invented by Gokul Sridharan (Sunnyvale, Calif.), Hung Dinh Ly (San Diego), Seyedkianoush Hosseini (San Diego) and Mahmoud Taherzadeh Boroujeni (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wireless communications are described. Generally, a UE may transmit, to a network entity, a first control message reporting a bundled transmission capability of the UE to transmit multiple bundled uplink transmissions for maintaining phase continuity for a plurality of physical u...