US Patent Issued to QUALCOMM on May 13 for "Integrated circuit assembly with hybrid bonding" (California Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,655, issued on May 13, was assigned to QUALCOMM Inc. (San Diego).

"Integrated circuit assembly with hybrid bonding" was invented by Jonghae Kim (San Diego), Milind Shah (San Diego), Periannan Chidambaram (San Diego) and Abdolreza Langari (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Certain aspects of the present disclosure generally relate to an integrated circuit assembly. One example integrated circuit assembly generally includes a first reconstituted assembly, a second reconstituted assembly, and a third reconstituted assembly. The first reconstituted assembly comprises at least one passive component and a first bonding layer. The se...