US Patent Issued to QUALCOMM on May 13 for "Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,873, issued on May 13, was assigned to QUALCOMM Inc. (San Diego).

"Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods" was invented by Suhyung Hwang (Rancho Mission Viejo, Calif.), Kun Fang (San Diego), Jaehyun Yeon (San Diego), Chin-Kwan Kim (San Diego) and Taesik Yang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods. The antenna module includes a radio-frequency (RF) IC (RFIC) package that includes one or more RFICs for supporting RF communica...