US Patent Issued to QUALCOMM on March 4 for "Package comprising channel interconnects located between solder interconnects" (California Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,855, issued on March 4, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising channel interconnects located between solder interconnects" was invented by Aniket Patil (San Diego), Durodami Lisk (San Diego), Hong Bok We (San Diego) and Charles David Paynter (Encinitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device comprising a first package and a second package coupled to the first package through a first plurality of solder interconnects. The first package includes a first substrate comprising at least one first dielectric layer and a first plurality of interconnects, and a first integrated device coupled to the first subst...