US Patent Issued to QUALCOMM on March 18 for "Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,381, issued on March 18, was assigned to QUALCOMM Inc. (San Diego).

"Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods" was invented by Ranadeep Dutta (Del Mar, Calif.), Jonghae Kim (San Diego) and Je-Hsiung Lan (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods. The antenna module includes a RF transceiver whose circuitry is split over multiple sem...