US Patent Issued to QUALCOMM on March 11 for "Bundling and timeline determination for multiple transport blocks scheduled by a single downlink control information message" (American, Chinese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,695, issued on March 11, was assigned to QUALCOMM Inc. (San Diego).

"Bundling and timeline determination for multiple transport blocks scheduled by a single downlink control information message" was invented by Ayan Sengupta (San Diego), Alberto Rico Alvarino (San Diego), Le Liu (San Jose, Calif.) and Chao Wei (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive a downlink control information (DCI) message from a base station that schedules multiple transport blocks (TBs) to be transmitted to the UE. Accordingly, the UE may determine a bund...