US Patent Issued to QUALCOMM on June 24 for "Package comprising an acoustic device and a polymer cap layer" (Austrian, American, German Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,488, issued on June 24, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising an acoustic device and a polymer cap layer" was invented by Sebastian Brunner (Graz, Austria), Changhan Hobie Yun (San Diego), Stefan Leopold Hatzl (Kloech, Austria), Manuel Hofer (Graz, Austria), Horst Droescher (Frauental an der LaBnitz, Austria) and Christian Hoffmann (Bavaria, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising an acoustic device, a polymer frame coupled to the acoustic device, a plurality of frame interconnects located in the polymer frame, where the plurality of frame interconnects are coupled to the acoustic device, ...