US Patent Issued to QUALCOMM on June 17 for "Substrate comprising an inductive coupler for signal leakage reduction" (American, Chinese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,252, issued on June 17, was assigned to QUALCOMM Inc. (San Diego).

"Substrate comprising an inductive coupler for signal leakage reduction" was invented by Rui Tang (Santa Clara, Calif.), Chenqian Gan (Cambridge, China) and Zhongning Liu (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate that includes at least one dielectric layer and an inductive coupler formed in the at least one dielectric layer. The inductive coupler includes a first inductor and a second inductor. The first inductor is formed in the at least one dielectric layer. The first inductor is configured to be electrically coupled to a transmitter filter and an antenn...