US Patent Issued to QUALCOMM on June 17 for "Apparatus and method for configuring a interconnect link between chiplets" (Indian Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,825, issued on June 17, was assigned to QUALCOMM Inc. (San Diego).

"Apparatus and method for configuring a interconnect link between chiplets" was invented by Prakhar Srivastava (Lucknow, India), Santhosh Reddy Akavaram (Hyderabad, India), Aditya Singh Patel (Jabalpur, India) and Ravi Kumar Sepuri (Hyderabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed techniques store certain information of functional modules and lanes to optimize a die-to-die interconnect link. Based on the information, the apparatus can optimize a link width and a multi-module link configuration of the interconnect link. An integrated circuit device include...