US Patent Issued to QUALCOMM on July 8 for "Package comprising a substrate and a high-density interconnect integrated device" (California Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,000, issued on July 8, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising a substrate and a high-density interconnect integrated device" was invented by Yangyang Sun (San Diego), Li-Sheng Weng (San Diego) and Zhimin Song (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, an interconnect integrated device coupled to the first integrated device and the second integrated device, and an underfill. The substrate includes a cavity. The interconnect integrated device is located over the cavity of the s...