US Patent Issued to QUALCOMM on July 8 for "Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,935, issued on July 8, was assigned to QUALCOMM Inc. (San Diego).

"Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods" was invented by Kuiwon Kang (San Diego), Chin-Kwan Kim (San Diego) and Joonsuk Park (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit (IC) package substrate with an embedded trace substrate (ETS) layer on a substrate, and related fabrication methods. The package substrate of the IC package includes an ETS layer provided on the substrate to facilitate providing higher density substrate interconnects to provide bump/solder joints...