US Patent Issued to QUALCOMM on July 15 for "Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,269, issued on July 15, was assigned to QUALCOMM Inc. (San Diego).

"Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods" was invented by Michelle Yejin Kim (San Diego), Kuiwon Kang (San Diego), Joan Rey Villarba Buot (Escondido, Calif.) and Ching-Liou Huang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit (IC) packages employing a supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer to reduce metal density mismatch, and related fabricat...