ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,179, issued on July 1, was assigned to QUALCOMM Inc. (San Diego).
"Symbol level interleaving in full-duplex slots" was invented by Ahmed Attia Abotabl (San Diego), Muhammad Sayed Khairy Abdelghaffar (San Jose, Calif.), Alexandros Manolakos (Escondido, Calif.), Seyedkianoush Hosseini (San Diego), Gabi Sarkis (San Diego), Yi Huang (San Diego), Wanshi Chen (San Diego) and Krishna Kiran Mukkavilli (San Diego).
According to the abstract* released by the U.S. Patent & Trademark Office: "In one aspect, a method of wireless communication includes determining, by a user equipment (UE), one or more full-duplex symbols of a slot and one or more half-duplex symbols of the slot; determining, b...