US Patent Issued to QUALCOMM on July 1 for "Frame structure design for downlink TDD-TDD carrier aggregation with pusch-less cell" (Chinese, American Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,463, issued on July 1, was assigned to QUALCOMM Inc. (San Diego).

"Frame structure design for downlink TDD-TDD carrier aggregation with pusch-less cell" was invented by Bo Chen (Beijing), Mingkai Nan (Beijing) and Alexei Yurievitch Gorokhov (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Wireless communications systems and methods related to transmitting communication signals with a carrier aggregated (CA) system TDD bands of a primary carrier component (PCC) and a secondary carrier component (SCC) PUSCH-less cell are provided. In particular, a CA frame structure with a PCC primary frame and an SCC secondary frame where a sounding reference...