ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,112, issued on Jan. 27, was assigned to QUALCOMM Inc. (San Diego).
"Thermal mitigation for SoC using memory access latency" was invented by Hithesh Hassan Lepaksha (Hyderabad, India), Sharath Kumar Nagilla (Hyderabad, India), Kalangi Fredy Sundar (Hyderabad, India) and Raveesh Sinha (Hyderabad, India).
According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects relate to using memory access latency to mitigate thermal excesses in a System on a Chip (SOC). An apparatus includes a processing core, a memory, and thermal monitor configured to determine a thermal state of the processing core. A memory controller is coupled to the processing core, to the thermal...