US Patent Issued to QUALCOMM on Jan. 13 for "Three-dimensional (3D) integrated circuit (IC) (3DIC) package with a bottom die layer employing an extended interposer substrate, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,574, issued on Jan. 13, was assigned to QUALCOMM Inc. (San Diego).

"Three-dimensional (3D) integrated circuit (IC) (3DIC) package with a bottom die layer employing an extended interposer substrate, and related fabrication methods" was invented by Yangyang Sun (San Diego), Stanley Seungchul Song (San Diego) and Lily Zhao (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional (3D) integrated circuit (IC) (3DIC) package with a bottom die layer employing an interposer substrate, and related fabrication methods. To facilitate the ability to fabricate the 3DIC package using a top die-to-bottom wafer process, a bottom die layer of th...