US Patent Issued to QUALCOMM on Jan. 13 for "Method and apparatus for optimum overlap ratio estimation for three dimensional (3D) reconstructions" (Indian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,524,906, issued on Jan. 13, was assigned to QUALCOMM Inc. (San Diego).

"Method and apparatus for optimum overlap ratio estimation for three dimensional (3D) reconstructions" was invented by Siddhant Sanjay Shirguppe (Belgaum, India), Ajay Surendranath (Bengaluru, India), Srikanth Thatipamula (Telangana, India) and Manoj Surya K (Bengaluru, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques and systems are provided for image processing. For instance, a process can include obtaining pose information for an image sensor, the pose information indicating a set of viewpoints of an environment, wherein the image sensor is configured to capture fra...