US Patent Issued to QUALCOMM on Jan. 13 for "Hybrid device cooling system" (Indian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,958, issued on Jan. 13, was assigned to QUALCOMM Inc. (San Diego).

"Hybrid device cooling system" was invented by Dhinesh Jambai Gopu (Bengaluru, India) and Thirukumaran Dechinamoorthy (Hyderabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a heat source, a vapor chamber, a bridge, and a heat pipe. The vapor chamber is in thermal communication with the heat source and comprises a working fluid. The heat pipe is in thermal communication with a heatsink and in fluid communication via the bridge with the vapor chamber."

The patent was filed on Aug. 2, 2023, under Application No. 18/363,924.

*For further information, includi...