US Patent Issued to QUALCOMM on Feb. 4 for "Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods" (California Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,041, issued on Feb. 4, was assigned to QUALCOMM Inc. (San Diego).

"Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods" was invented by Jihong Choi (San Diego), Giridhar Nallapati (San Diego), William Stone (San Diego), Jianwen Xu (San Diego), Jonghae Kim (San Diego), Periannan Chidambaram (San Diego) and Ahmer Syed (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate and related fabrication methods. The embedded capacitor ...