US Patent Issued to QUALCOMM on Feb. 3 for "Package comprising a first substrate, a second substrate and an electrical device coupled to a bottom surface of the second substrate" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,599, issued on Feb. 3, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising a first substrate, a second substrate and an electrical device coupled to a bottom surface of the second substrate" was invented by Aniket Patil (San Diego), Brigham Navaja (San Diego) and Hong Bok We (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a first substrate, a first integrated device coupled to the first substrate, a second substrate coupled to the first substrate through a first plurality of solder interconnects such that the first integrated device is located between the first substrate and the second substrate, wherein the ...