ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,552, issued on Feb. 18, was assigned to QUALCOMM Inc. (San Diego).
"Recess structure for padless stack via" was invented by Hong Bok We (San Diego), Joan Rey Villarba Buot (Escondido, Calif.) and Aniket Patil (San Diego).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a stack via structure in which a plurality of vias are stacked over each other. At least one via is a via that has a recess formed from a top surface thereof. Another via above the via is formed such that a bottom portion of the another via is in the recess of the via. In this way, no capture pad is needed between the via and the another via. Also, contact area between the v...