US Patent Issued to QUALCOMM on Feb. 10 for "Configuration and measurement enhancements for double-sided round trip time" (Chinese, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,113, issued on Feb. 10, was assigned to QUALCOMM Inc. (San Diego).

"Configuration and measurement enhancements for double-sided round trip time" was invented by Jing Dai (Beijing), Alexandros Manolakos (Escondido, Calif.), Sony Akkarakaran (Poway, Calif.), Srinivas Yerramalli (San Diego), Guttorm Ringstad Opshaug (Redwood City, Calif.) and Weimin Duan (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A UE receives, from a BS, information indicating a first TEG delay at the BS for a transmission of a first PRS, a second TEG delay at the BS for a reception of an SRS from the UE, a third TEG delay at the BS for a transmission of a second PRS, a...