US Patent Issued to QUALCOMM on Dec. 9 for "Devices configured for near-field ultrasonic imaging" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,080, issued on Dec. 9, was assigned to QUALCOMM Inc. (San Diego).

"Devices configured for near-field ultrasonic imaging" was invented by Shiang-Chi Lin (Taoyuan, Taiwan), Jessica Liu Strohmann (Cupertino, Calif.) and Hrishikesh Vijaykumar Panchawagh (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some disclosed devices include a display system having a display stack, an ultrasonic fingerprint sensor system including an ultrasonic fingerprint sensor system stack and a stiffener layer residing between the display stack and the ultrasonic fingerprint sensor system stack. In some examples, the stiffener layer may have a stiffener layer ...