US Patent Issued to QUALCOMM on Dec. 9 for "Apparatus and methods for memory fault detection within die architectures" (Indian Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,514, issued on Dec. 9, was assigned to QUALCOMM Inc. (San Diego).

"Apparatus and methods for memory fault detection within die architectures" was invented by Sateeshkumar Injarapu (Bangalore, India), Manish Kumar Saxena (Bangalore, India), Amit Duggal (Bangalore, India) and Nitin Jaiswal (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatuses directed to memory fault detection mechanisms within die architectures. In some examples, a die package includes decoder logic that receives multiple data words, and a first error correcting code for each of the data words. The decoder logic generates, for each of the data words,...