US Patent Issued to QUALCOMM on Dec. 30 for "Integrated device substrate including embedded electromagnetic isolation structure" (California Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,401, issued on Dec. 30, was assigned to QUALCOMM Inc. (San Diego).

"Integrated device substrate including embedded electromagnetic isolation structure" was invented by Yue Li (San Diego), Durodami Lisk (San Diego) and Charles David Paynter (Encinitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device includes a substrate that includes one or more conductors and a conductive wall via defining at least a portion of an electromagnetic (EM) isolation structure for the one or more conductors."

The patent was filed on Jan. 23, 2024, under Application No. 18/419,763.

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