US Patent Issued to QUALCOMM on Dec. 30 for "Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,593, issued on Dec. 30, was assigned to QUALCOMM Inc. (San Diego).

"Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methods" was invented by Ranadeep Dutta (Del Mar, Calif.), Jonghae Kim (San Diego) and Je-Hsiung Lan (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna module as a radio-frequency (RF) integrated circuit (IC) semiconductor die ("die") with an integrated antenna substrate. The die with the integrated antenna substrate can be provided as part of a single IC chip that is fabricated as part of a wafer-level fabrication process as an example...