ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,231, issued on Dec. 23, was assigned to QUALCOMM Inc. (San Diego).
"Techniques for interleaving in full-duplex slots" was invented by Ahmed Attia Abotabl (San Diego), Muhammad Sayed Khairy Abdelghaffar (San Jose, Calif.), Gabi Sarkis (San Diego), Alexandros Manolakos (Escondido, Calif.) and Seyedkianoush Hosseini (San Diego).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wireless communications are described. The techniques described herein may enable frequency domain interleaving for a transmission direction depending on a codeblock mapping configuration, a transport block size, or both. For example, a device (e.g.,...