US Patent Issued to QUALCOMM on Dec. 16 for "Variable link width in two directions for main band chip module connection" (Indian Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,077, issued on Dec. 16, was assigned to QUALCOMM Inc. (San Diego).

"Variable link width in two directions for main band chip module connection" was invented by Ravindranath Doddi (Hyderabad, India), Umamaheshwaran V (Salem, India), Afreen Haider (Muzaffarpur, India), Lekhya Pavani Godavarthi (Hyderabad, India) and Harinatha Reddy Ramireddy (Hyderabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects relate to variable link width in two directions for a main band chip module connection. In one aspect, a different set of data lines is active for transmit and receive data lines. In one example a method includes sending an enable request fro...