US Patent Issued to QUALCOMM on Dec. 16 for "Substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength, and related IC packages and fabrication methods" (California Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,146, issued on Dec. 16, was assigned to QUALCOMM Inc. (San Diego).

"Substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength, and related IC packages and fabrication methods" was invented by Michelle Yejin Kim (Carlsbad, Calif.), Hong Bok We (San Diego), Joan Rey Villarba Buot (Escondido, Calif.) and Kuiwon Kang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength. In one aspect, a substrate comprises a core layer. The core layer compris...