US Patent Issued to QUALCOMM on Dec. 16 for "Radio frequency (RF) front end envelope tracking with machine learning" (California Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,552, issued on Dec. 16, was assigned to QUALCOMM Inc. (San Diego).

"Radio frequency (RF) front end envelope tracking with machine learning" was invented by Mustafa Keskin (San Diego) and Paul Brian Sheehy (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects described herein include devices and methods for an envelope tracking power supply. In some aspects, the envelope tracking power supply includes an envelope signal input port, an output power port, an input interface circuit coupled to the envelope signal input port, sensing and conditioning circuitry, and amplifier circuitry coupled between the input interface circuit and the sensin...