US Patent Issued to QUALCOMM on Dec. 16 for "Package comprising an interconnection die located between substrates" (California Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,187, issued on Dec. 16, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising an interconnection die located between substrates" was invented by Yangyang Sun (San Diego), Zhijie Wang (San Diego), Wei Wang (San Diego) and Marcus Hsu (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a first substrate; a first integrated device coupled to the first substrate; an interconnection die coupled to the first substrate; a second substrate coupled to the first substrate through the interconnection die such that the first integrated device and the interconnection die are located between the first substrate and the second su...