US Patent Issued to QUALCOMM on Aug. 5 for "Expanded data link width for main band chip module connection in alternate modes" (Indian Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,380,047, issued on Aug. 5, was assigned to QUALCOMM Inc. (San Diego).

"Expanded data link width for main band chip module connection in alternate modes" was invented by Ravindranath Doddi (Hyderabad, India), Umamaheshwaran V (Salem, India), Afreen Haider (Muzaffarpur, India), Lekhya Pavani Godavarthi (Hyderabad, India) and Harinatha Reddy Ramireddy (Hyderabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects relate to an expanded data link width for a chip connection. In one example a sideband transmitter of a module of a first die is configured to send an expanded data link width enable request to a module partner through a sideband of a die...