US Patent Issued to QUALCOMM on Aug. 26 for "Package comprising integrated devices and bridge coupling top sides of integrated devices" (California Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,966, issued on Aug. 26, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising integrated devices and bridge coupling top sides of integrated devices" was invented by Bharani Chava (San Diego), Abinash Roy (San Diego), Stanley Seungchul Song (San Diego) and Jonghae Kim (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a substrate; a first integrated device coupled to the substrate through at least a first plurality of solder interconnects; a second integrated device coupled to the substrate through at least a second plurality of solder interconnects; a first bridge coupled to the first integrated device and the s...