ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,544, issued on Aug. 19, was assigned to QUALCOMM Inc. (San Diego).
"Dynamic die-to-die serial lane configuration" was invented by Kunal Desai (Bangalore, India) and Deepak Kumar Agarwal (Bangalore, India).
According to the abstract* released by the U.S. Patent & Trademark Office: "A die-to-die serial data link may be dynamically configured to exclude lanes associated with data errors. In a test mode, data may be transmitted from a first die to a second die over lanes of the link. In the second die, data received on the link in the test mode may be compared with an expected data pattern to detect any bit mismatches. When there are no more than a threshold number of mismatched bits...