US Patent Issued to QUALCOMM on April 29 for "Vertically integrated device stack including system on chip and power management integrated circuit" (Washington, California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,898, issued on April 29, was assigned to QUALCOMM Inc. (San Diego).

"Vertically integrated device stack including system on chip and power management integrated circuit" was invented by Peng Zou (Camas, Wash.) and Syrus Ziai (Los Altos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a package substrate, a system-on-chip (SoC) die, and a power management integrated circuit (PMIC) die, arranged in a vertical stack. The SoC die is disposed on a first surface of the package substrate, and the PMIC die is mechanically coupled to a second surface of the package substrate. The PMIC die is electrically coupled to the SOC die...