US Patent Issued to QUALCOMM on April 29 for "Thermal mitigation in user equipment having multiple communication modules" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,713, issued on April 29, was assigned to QUALCOMM Inc. (San Diego).

"Thermal mitigation in user equipment having multiple communication modules" was invented by Mahbod Ghelichi (San Diego), James Francis Geekie (Carlsbad, Calif.), Raghu Narayan Challa (San Diego), Mihir Vijay Laghate (San Diego), Ruhua He (San Diego) and Yong Li (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some aspects, the present disclosure provides methods, apparatuses, and systems for efficient thermal mitigation while maintaining wireless device performance on a primary component carrier (PCC). Embodiments described may include implementation of target transceive...