US Patent Issued to QUALCOMM on April 15 for "Systems and methods to signal a changing quantity of layers in a multi-subscriber identity module device" (Indian Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,786, issued on April 15, was assigned to QUALCOMM Inc. (San Diego).

"Systems and methods to signal a changing quantity of layers in a multi-subscriber identity module device" was invented by Akash Srivastava (Hyderabad, India), Tanay Kabra (Hyderabad, India), Priyangshu Ghosh (Hyderabad, India), Karthikeyan Sabapathi (Hyderabad, India), Pankaj Bansal (Hyderabad, India), Manasa Yarramasu (Guntur, India) and Mahender Reddy Akkapally (Hyderabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A user equipment (UE) includes: a first subscriber identity module (SIM) associated with a first service provider subscription and a second SIM associated wit...