US Patent Issued to QUALCOMM on April 15 for "Interleaver design for multi-slot uplink shared channel transmission" (California Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,279,238, issued on April 15, was assigned to QUALCOMM Inc. (San Diego).

"Interleaver design for multi-slot uplink shared channel transmission" was invented by Gokul Sridharan (Sunnyvale, Calif.), Seyedkianoush Hosseini (San Diego), Hung Dinh Ly (San Diego) and Peter Gaal (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may select, for a communication on a multi-slot transmission occasion, coded bits of a plurality of coded bits on a per slot basis, for each of multiple slots of the multi-slot transmission occasion. The UE ...