ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,110, issued on Nov. 4, was assigned to Qorvo US Inc. (Greensboro, N.C.).
"Laminate substrate with embedded multi-layered heat slug" was invented by Bo Zhao (Allen, Texas) and Alex Arayata (McKinney, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure is directed to an electronic device with an embedded multi-layered heat slug. The electronic device in includes a substrate having a substrate body with a laminate layer. The substrate further includes a heat slug embedded within the substrate body. The heat slug includes a top layer having a first thermal conductivity and a first thermal expansion coefficient, a bottom layer having a sec...