US Patent Issued to Qorvo US on Nov. 25 for "Multi-level 3D stacked package and methods of forming the same" (North Carolina, California Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,731, issued on Nov. 25, was assigned to Qorvo US Inc. (Greensboro, N.C.).

"Multi-level 3D stacked package and methods of forming the same" was invented by Julio C. Costa (Oak Ridge, N.C.), George Maxim (Saratoga, Calif.) and Baker Scott (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a multi-level three-dimensional (3D) package with multiple package levels vertically stacked. Each package level includes a redistribution structure and a die section over the redistribution structure. Each die section includes a thinned die that includes substantially no silicon substrate and has a thickness between se...