ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,762, issued on Nov. 25, was assigned to Qorvo US Inc. (Greensboro, N.C.).
"Heat sinking by thru-mold vias in shielded modules" was invented by Tobias Mangold (Huglfing, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a module package with a shielded module and a process for making the same. The disclosed shielded module includes a module board, at least one flip-chip die attached to the module board, a mold compound with at least one via hole, and a shielding structure. The mold compound resides over the module board to partially encapsulate the at least one flip-chip die, where the at least one via hole exte...