US Patent Issued to Qorvo US on June 17 for "System in package with flip chip die over multi-layer heatsink stanchion" (Texas, Florida Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,413, issued on June 17, was assigned to Qorvo US Inc. (Greensboro, N.C.).

"System in package with flip chip die over multi-layer heatsink stanchion" was invented by Kelly M. Lear (Longwood, Fla.), Jeffrey Miller (Allen, Texas), Mihir Roy (Sachse, Texas) and Christine Blair (Lewisville, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a system in package having a chiplet with a first substrate and a first die deposed over the first substrate, a second die, a second substrate that the chiplet and the second die are deposed over, and a heatsink spreader deposed over the chiplet and the second die. Herein, the first...