ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,375, issued on Dec. 30, was assigned to Qorvo US Inc. (Greensboro, N.C.).
"System in a package (SIP) with air cavity" was invented by Md Hasnine (Richardson, Texas), Jeffrey Miller (Allen, Texas), Yu Gary Gu (Colfax, N.C.) and Neftali Salazar (Oak Ridge, N.C.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system in package (SiP) with an air cavity is disclosed. In one aspect, a technique to bond a lid over the air cavity that reduces the risk of cavity integrity failure is provided. More specifically, a metal ring is provided that conforms to or is congruent to a shape of a lower lip of the lid. A dielectric material covers the metal ring, and a l...