ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,817, issued on Dec. 30, was assigned to QINGDING PRECISION ELECTRONICS (HUAI'AN) Co. LTD. (Jiangsu Province, China) and GARUDA TECHNOLOGY Co. LTD. (New Taipei, Taiwan).
"Circuit board and manufacturing method thereof" was invented by Hao-Wen Zhong (Shenzhen, China) and Fang-Bo Xu (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes a first multilayered structure, a second multilayered structure, a third multilayered structure, a first adhesive layer, a second adhesive layer and a plurality of hollow portions. The first adhesive layer is disposed between the first multilayered structure and the second multilayered ...