ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,252, issued on May 20, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China) and Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China).
"Interposer, manufacturing method therefor, and circuit board assembly" was invented by Man-Zhi Peng (Huaian, China), Rui-Wu Liu (Huaian, China), Si Xiong (Shenzhen, China) and Lin-Jie Gao (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer, which is used to connect two circuit boards, includes an inner structure (10), an outer structure (20), and a protective layer (50). The inner structure (10) includes a first base layer (11) and a first wiring layer (131) forme...