ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,238,871, issued on Feb. 25, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China) and Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China).

"Method for manufacturing component embedded circuit board" was invented by Yong-Chao Wei (Qinhuangdao, China) and Yong-Quan Yang (Qinhuangdao, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second...